|
|
||||||||
|---|---|---|---|---|---|---|---|---|---|
| ( 上圖可點選放大 ) | |||||||||
產品名稱| name:
| Features: 1.High Throughput 2.High Accuracy 3.Advanced GUI for Defect Data Analysis 4.Measurement of Bump Pitch, Offset, Bump Shape |
|
|
|
||||||||
|---|---|---|---|---|---|---|---|---|---|
| ( 上圖可點選放大 ) | |||||||||
| Features: 1.High Throughput 2.High Accuracy 3.Advanced GUI for Defect Data Analysis 4.Measurement of Bump Pitch, Offset, Bump Shape |