MLVS Series ■ Features 1. Insulator over-coat keeps excellent low and stable leakage current. 2. Solder layer plating for terminal electrode keep excellent assembly solderability even after long term storage. 3. Low clamping Voltage. 4. Compact size for EIA0603 and 0402. 5. Quick response time (<1nSec.) 6. High transient current capability 7. Meet IEC 61000-4-2, 61000-4-4, and 61000-4-5 Standard.
■ Applications Applications for Mother Board, Notebook , Cellular Phone, PDA , Handheld Device, DSC, DV, Scanner, and Set-Top Box etc.